產品描述: MS7801壓力芯片的主要組成部分是MEMS硅片。植入電阻利用壓阻效應感應硅片的形變，并轉換成電信號。壓焊的Pyrex耐熱玻璃在絕壓芯片的背面形成一個密封的真空腔，玻璃的厚度分別為0.2mm（MS7801-A_0.2）和0.5mm（MS7801-A_0.5）。差壓的芯片則有壓焊帶孔耐熱玻璃（MS7801-D）和不帶耐熱玻璃（MS7801-S）兩種。
特點:
- 量程：0~1bar（14.5psi）
- 典型線性：0.05%
- 絕壓或差壓
- 芯片尺寸：2.0 x 1.86 mm
- 高可靠性，低成本
壓力轉換
| Kpa | bar | mbar | PSI | atm | mm Hg | m H2O | Inches H2O |
| 100 | 1 | 1000 | 14.5 | 0.987 | 750 | 10.197 | 401 |
比率
| 參數 | 符號 | 條件 | 最小 | | 單位 |
| 供應電壓 | VS+ | Ta=25℃ | | 20 | V |
| 儲存溫度 | Ts | | -40 | +150 | ℃ |
| 過壓 | | | | 5 | bar |
電氣特性
(Reference conditions:Supply Voltage VS+=5Vdc; Ambient Temperature Ta=25℃)
| 參數 | 最小 | 典型 | | 單位 | 備注 |
| 工作壓力范圍 | 0 | | 1 | Bar | |
| 工作溫度范圍 | -40 | | 125 | ℃ | |
| 橋路電阻 | 3.0 | 3.4 | 3.8 | KΩ | |
| Fullscale span (FS) | 120 | 150 | 180 | mV | |
| Zero Pressure Offset | -40 | 0 | 40 | mV | |
| 線性 | | ±0.05 | ±0.2 | %FS | 1 |
Temperature Coefficient of Resistance Span Offset | +2400 -1500 -80 | +2800 -1900 | +3300 -2300 +80 | ppm/℃ ppm/℃ μV/℃ | 2 |
| 壓力遲滯 | | ±0.05 | ±0.15 | %FS | 3 |
| 重復性 | | ±0.05 | ±0.15 | %FS | 4 |
| 溫度遲滯 | | | 0.3 | %FS | 5 |
NOTES
1) Deviation at one half fullscale pressure from the least squaresbest line fit over pressure range (0 to bar).
2) Slope of the endpoint straight line from 25℃ to 60℃.
3) Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25℃.
4) Same as 3) after 10 pressure cycles
5) Maximum difference in offset after one thermal cycle from -40℃to +125℃.
訂購信息
| 產品 | 類型 | 產品說明 | 編號 |
| MS7801A_0.2 | 絕壓 | 1bar Pressure Sensors 0.2 mm borosilicate glasssawn on b/f | 780125022 |
| MS7801A_0.5 | 絕壓 | 1bar Pressure Sensors 0.5 mm borosilicate glasssawn on b/f | 780125021 |
| MS7801-D | 差壓 | 1bar Pressure Sensors sawn on b/f | 780125121 |
| MS7801-S | 差壓 | 1bar Pressure Sensors no borosilicate glasssawn on b/f | 780125221 |
The MS7801dice are supplied sawn on blue foil, mounted on plastic rings.
